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  • Prof. Wu Hequan, Former Vice-President, Chinese Academy of Engineering, China
  • Dr. Nobuhiro Endo, CEO NEC Corporation, Japan
  • Prof. Hoi Sing Kwok, Chair Professor, ECE Department, HKUST, Hong Kong
  • Prof. George Arnold, National Coordinator for Smart Grid Interoperability, National I Institute of Standards and Technology, USA
  • Prof. Tony Chan, President, Hong Kong University of Science and Technology, Hong Kong
  • Prof. Teck Seng Low, Managing Director - Agency for Science, Technology and Research (A*STAR), Singapore
  • Dr. Rico Malvar, Chief Scientist of Microsoft Research, USA
  • Prof. Ada Poon, EE Department, Stanford University, USA
  • Prof. Henning Sirringhaus, Hitachi Professor of Electron Device Physics, University of Cambridge, UK
  • Prof. Shigeru Sasaki, Senior Vice President, Fujitsu Laboratories Ltd., Japan
  • Dr. Jan Färjh, Head of Ericsson research, Sweden
  • Dr. Philipp Zhang, Chief Scientist, Huawei Technologies co., Ltd., China
  • Mr. Joe Weinman Worldwide Lead, Communications, Media, and Entertainment Industry Solutions, Hewlett-Packard, USA
  • Prof. David Cheung, Head of Department of Computer Science, Director of the Center for E-commerce Infrastructure Development (CECID), The University of Hong Kong
  • Dr. Peter Hartwell Distinguished Technologist, Hewlett-Packard Company, USA
  • Prof. Binxing Fang President of the Beijing University of Post and Telecommunications, China
  • Dr. Roberto Saracco Director, Future Centre Telecom Italia, Italy
  • Dr. Ghavam Shahidi IBM Fellow, Director of Silicon Technology, IBM Watson Research Center, USA
  • Dr. Dennis D. Buss Vice President, Silicon Technology Development, Texas Instruments Incorporated, USA
  • Dr. Raj Jammy VP, Materials and Emerging Technologies, Sematech, USA
  • Prof. Hugh Bradlow Chief Technology Officer, Telstra, Australia
  • Dr. Minoru Etoh Managing Director of Service & Solution Development Department, NTT DoCoMo, Japan
  • Dr. Tero Ojanperä Executive VP, Head of Services and Development Experience, Nokia, Finland
  • Prof. Ralph Etienne Cummings Department of Electrical and Computer Engineering, John Hopkins University, USA
  • Prof. Jun Ohta Nara Institute of Science and Technology, Japan
  • Prof. Yongmin Kim Department of Electrical Engineering, University of Washington, USA
  • Dr. Hong-Jiang Zhang CTO, Asia-Pacific R&D/Managing Director, Advanced Technology Center, Microsoft, USA
  • Prof. Yuan-Ting Zhang Head of Division of Biomedical Engineering, CUHK, HK
  • Dr. Shen-Chang Chao Vice President and Group Director Enterprise & Consumer Electronics Group, ASTRI, HK
  • Prof. Bernard Kippelen Director, Center for Organic Photonics and Electronics, Georgia Institute of Technology, USA
  • Prof. Esko I. Kauppinen Professor and Chief Scientist, Canatu Oy, Finland
  • Prof. Didier Pribat Sungkyunkwan University, Korea
  • Prof. Masahiro Fujita President of System Technologies Laboratories, Sony Corporation, Japan
  • Dr. Wouter Leibbrandt Manager, Advanced Systems Lab, NXP Semiconductors, Netherlands
  • Prof. Micheal Austin Vice President, BYD America, USA
  • Mr. Pierre Mars Vice President, Applications Engineering, CAP-XX, Australia
IEEE TTM 2011: Keynote and Invited Speakers
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